Harbin Institute of Technology, Shenzhen
Top Chinese universities; Located in Shenzhen, with developed economy, convenient transportation, and wide employment opportunities; Scholarship available.
概述
About HITSZ >>>
Undergraduate Programs(English-Taught)
Computer Science and Technology | Software Engineering | IOT(Internet of Things) Engineering | Data Science and Big Data Technology | Electrical Engineering and Automation | Electronics Science and Technology | Communication Engineering | Opto-Electronic Information Science and Engineering | Electronics Packaging Technology | Artificial Intelligence | Mechanical Design, Manufacturing and Automation | Industrial Design | Intelligent Manufacturing Engineering | Additive Manufacturing Engineering | Energy and Power Engineering | Robot Engineering | Intelligent Equipment and Systems | Intelligent Construction | Eco-Engineering of Environment | Smart Materials and Structures | Intelligent Building and Intelligent Construction | Engineering Management | Big Data Management and Application | Computational Finance | Business Adiministration | Accounting | Electronic Business | Finance | International Economy and Trade | Economics | Digital Economy | Integrated Science | Digital Media Art
Undergraduate Programs(Chinese-Taught)
Economics | Mechanical Design, Manufacturing and Automation | Energy and Power Engineering | Electrical Engineering and Automation | Communication engineering | Optoelectronic Information Science and Engineering | Robotics Engineering | Computer Science and Technology | Data Science and Big Data Technology | Accounting
Fees & Scholarship
Tuition Fee: 4,200 USD/Year;
Accommodation Fee: 140 USD/month/bed + 280 USD deposit(Single room); 70 USD/month/bed + 140 USD deposit(Double room);
Scholarship:
A: Guangdong Province Scholarship: 1,350 USD/Year;
B: Shenzhen Universiade Scholarship: 5,500 USD/Year;
C: HITSZ Scholarship: Tuition waiver + 140 USD/month; Tuition waiver; 20%~50% deduction of the tuition.
Who can apply?
Be a high school diploma holder or its equivalent.
Application Materials
Payment receipt of application fee.